Titanium Aluminum Sputter Targets
Titanium Aluminum Sputter Targets
Magnetron sputtering technology is one of the key technologies for preparing thin film materials, and the metal sputtering target is the key material in the sputtering process. Titanium Aluminum Sputter Targets can be produced by electron beam smelting and vacuum consumable electric arc furnace smelting. It has the excellent properties of metal titanium and metal aluminum, such as high ductility, high wear resistance, and excellent electrical conductivity. And thermal conductivity, the best microstructure, good durability, good etching performance and processing performance, good bonding performance with the substrate, etc.
Titanium Aluminum Sputter Targets can sputter hard and oxidation-resistant nitride coatings (TiAlN) on drills, cutters, indexable cutting inserts and other tools, and improve the feed rate, cutting performance and service life of processing tools. Titanium Aluminum Metal Sputter Targets also produces adhesive and capping layers in integrated circuits, decorative coatings for electronic devices (such as dials for cell phones, flat panel displays, or luxury watches), and glass coatings for the automotive industry.
Titanium Aluminum Sputter Targets Specifications:
|
Grade |
TiAl25/75,30/70,40/60 |
|
Technique |
Hot isostatic pressing,Smelting,Sintering,Forging,Annealing |
|
Purity |
99.5-99.9% |
|
Thickness |
3mm-30mm |
|
Length |
10mm-2000mm |
|
Diameter |
<500 mm |
|
Density |
4.54g/cm3 |
|
Shape |
Discs,Plates,Column Targets,Step Targets,Custom-made |
|
Surface |
Polished,Alkali Cleaning,Grinding,Black Oxide, etc. |
|
Delivery Time |
20-30 days |
|
Certification |
ISO9001 |
Titanium Aluminum Metal Sputter Targets Picture:
